Flexible circuit boards offer numerous advantages, including space savings, reduced weight, and increased flexibility. As global demand for these boards continues to rise, it's essential to understand the key considerations when using laser technology for high-density flexible circuit boards and microvia drilling. High-density flexible circuits are typically defined as having a line pitch of less than 200 μm or microvias smaller than 250 μm. These boards are widely used in sectors such as telecommunications, computing, integrated circuits, and medical devices. The unique properties of flexible circuit boards make them a viable alternative to rigid PCBs and traditional wiring methods. They also drive innovation in emerging fields. One of the fastest-growing applications is in hard disk drives (HDDs), where flexible wires replace conventional wiring to connect the moving read/write head with the control board. Technologies like "floating flexible board" (FOS) and wireless suspension enhance reliability and reduce assembly costs. Another key application is the interposer flex between the suspension and the controller in HDDs. In the field of integrated circuits, chip-scale packages (CSPs), multi-chip modules (MCMs), and flexible COFs are gaining traction. The CSP market is particularly significant, especially in flash memory used in PCMCIA cards, mobile phones, and digital cameras. Additionally, LCDs, mylar switches, and inkjet printer cartridges represent other high-growth areas for high-density flexible circuits. Portable devices like mobile phones benefit greatly from flexible circuit technology due to their need for compact and lightweight designs. Emerging applications include flat panel displays and medical devices, where flexible circuits help reduce product size and weight—ideal for hearing aids and implantable medical devices. The growing demand for these technologies has led to a surge in flexible circuit board production worldwide. For example, HDD sales were expected to reach 345 million units in 2004, doubling from 1999 levels. Mobile phone sales in 2005 reached 600 million units, driving a 35% annual increase in high-density flexible PCB production, reaching 3.5 million square meters by 2002. This growth necessitates efficient and cost-effective manufacturing techniques, with laser processing playing a crucial role. Lasers are used for cutting, drilling, and scribing in flexible circuit board manufacturing. UV and FIR lasers are commonly employed, with excimer and UV-DPSS lasers used for UV processing, and sealed CO2 lasers for FIR. Laser processing offers non-contact precision, allowing for accurate shaping and drilling without physical tools. Vector scanning technology, controlled by CAD/CAM software, enables precise cutting and drilling patterns. During forming, the laser beam remains on while scanning, whereas during drilling, it turns on only at specific points. Slicing involves removing layers of material, often using CO2 lasers due to their effectiveness with copper. Drilling microvias is primarily done via laser, offering faster and more reliable results compared to mechanical or plasma methods. While plasma etching provides high reliability, it is costly and time-consuming. Laser drilling, on the other hand, is efficient, low-cost, and requires minimal maintenance. When selecting a laser, CO2 and UV-DPSS models are preferred for their speed and cost-effectiveness. Sealed CO2 lasers offer high pulse frequencies and long operational life, making them ideal for high-volume production. UV-DPSS lasers, with their short wavelength, provide fine precision suitable for small vias. In conclusion, the choice of laser depends on the material and application. High-energy, low-repetition-rate lasers are used for materials like copper, while low-energy, high-repetition-rate lasers are better for polyimide films. Most large-diameter vias are processed in two steps: first with UV-DPSS to drill through copper, then with CO2 to remove the dielectric. This approach ensures efficiency and quality in high-density flexible circuit board manufacturing.

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